The Lian Li Lancool III case's thoughtful tweaks ease headaches for PC builders

The Lian Li Lancool II earned near universal praise at its launch—at $90, it was an affordable, beautiful mesh case with good airflow. Now less than a year later, the company has unveiled the Lancool II’s apparent successor with a YouTube reveal on Monday, during its 2021 Digital Expo 2.0.

The Lancool III takes much of the Lancool II’s formula and enhances it, with multiple small tweaks that are likely to add up to an even smoother building experience. Some are design changes that give the Lancool III a sleeker look, like softer angles on the front panel. Many appear to be enhance modularity or functionality: Starting at the front of the case, you can position the I/O panel at either the top or the bottom of the panel. Said panel has a much larger mesh section, too. And the fan and radiator mounting bracket behind it not only accommodates four different positions, but is now toolless as well.

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